PCB Repair & IC Pinouts
PCB silicon map, IC pinouts, and safe rework of the 30344 smart driver.
PCB silicon map, IC pinouts, and safe rework of the 30344 smart driver.
When diagnosing severe physical ECU damage—such as blown injector drivers from pinched wiring harnesses, burned throttle motor H-bridges, or shorted 5.0\text{V} sensor reference supplies—calibrating software is useless without physical board repair. The Bosch ME7.5 printed circuit board utilizes a multi-layer FR-4 stackup with heavy internal copper ground planes designed to sink inductive energy.
This section provides the component-level silicon reference map, tracing the primary integrated circuits (ICs) on the ME7.5 motherboard, their functional roles, pinouts, and physical rework protocols.
┌──────────────────────────────────────────────────────────────────────────────────────────────────┐
│ BOSCH ME7.5 PRINTED CIRCUIT BOARD (PCB) SILICON COMPONENT MAP │
├──────────────────────────────────────────────────────────────────────────────────────────────────┤
│ [ 121-Pin Wiring Header ] │
│ │ │
│ ┌───────────────────────┬──────────────────┴──────────────────┬───────────────────────┐ │
│ ▼ ▼ ▼ ▼ │
│ [ Bosch 30344 / CJ945C ] [ Bosch 30348 / CJ220 ] [ Bosch 30345 / CJ125 ] [ TJA1050 ] │
│ Smart Low-Side Driver H-Bridge DC Motor Driver Wideband O2 Controller High-Speed CAN │
│ Drives: Injectors 1–4, Drives: Electronic Throttle Interfaces: LSU 4.2 Transceiver │
│ N75, N249, N205, N112, Plate Motor (G186) Pins 51, 52, 70, 71 Pins 58 & 60 │
│ N80, J17, J299, Pin 116 │
│ │ │ │ │ │
│ └───────────────────────┼─────────────────────────────────────┼───────────────────────┘ │
│ ▼ ▼ │
│ [ Siemens / Infineon C167CR-LM ] [ Bosch 30343 Power Management ] │
│ 16-Bit RISC Microcontroller Multi-rail regulator: +5.0V Sensor, │
│ 144-Pin MQFP Package +3.3V Logic, Power-On Reset, K-Line │
│ │ │ │
│ ▼ ▼ │
│ [ AMD AM29F800BB Flash ] [ ST 95040 / 95080 SPI EEPROM ] │
│ 1024 KB Parallel Flash (44-Pin SOP) 512B / 1024B Non-Volatile Memory │
└──────────────────────────────────────────────────────────────────────────────────────────────────┘
34.1. Master Silicon IC Reference & Functional Registry#
| Component Marking | Industry / OEM Part No. | Package Type | Functional Role & Pin Count | Typical Failure Mode |
|---|---|---|---|---|
C167CR-LM | SAK-C167CR-LM (Infineon) | 144-Pin MQFP | Main 16-Bit Processing Unit (24 MHz) | Complete ECU no-communication / bricked |
AM29F800BB | AM29F800BB-70SE (AMD/Spansion) | 44-Pin PSOP | 1024 KB External Parallel Flash Memory | Checksum failure / corrupted boot sector |
95040 / 95080 | STMicroelectronics 95040/95080 | 8-Pin SOIC | Serial SPI EEPROM (Adaptations & Immo) | DTC P1603 (EEPROM Error) / Immo locked |
30343 | Bosch Custom Power ASIC | 36-Pin PowerSO | Voltage Regulator (5V/3.3V) & K-Line | No 5V sensor power (P0642) / No K-Line |
30344 / CJ945C | Bosch Smart DMOS Switch | 64-Pin HiQuad | 14-Channel Low-Side Power Driver | Blown injector channel / Stuck N75 |
30348 / CJ220 | Bosch Full H-Bridge | 20-Pin PowerSO | Bidirectional E-Gas Motor Driver (G186) | Throttle limp mode (P1545 / P1559) |
30345 / CJ125 | Bosch Wideband Interface | 24-Pin SOIC | LSU 4.2 Nernst/Pump Cell Controller | O2 heater / activity DTCs (P0130/P0134) |
30397 / CK110 | Bosch Ignition Pre-Driver | 20-Pin SSOP | 4-Channel 5V Logic Trigger for Coils | Dead ignition cylinder (No spark on cyl N) |
HIP9011 | Harris / Intersil HIP9011 | 28-Pin SOIC | Dual Knock Sensor Signal Conditioning | Knock sensor circuit DTCs (P0327/P0332) |
TJA1050 | NXP TJA1050 / PCA82C250 | 8-Pin SOIC | 500 kbps Differential CAN Transceiver | CAN bus communication dropout (P1626) |
34.2. Pinout & Channel Mapping of the Bosch 30344 Smart Low-Side Driver#
The Bosch 30344 is a 14-channel smart power DMOS array with integrated internal voltage clamping (45\text{V}) to safely absorb the inductive flyback energy generated when solenoids and fuel injector coils collapse:
| Channel Output Pin | Target Wiring Terminal | Driven Actuator Subsystem |
|---|---|---|
| Output Channel 1 | ECU Pin 88 | Fuel Injector Cylinder 1 (N30) |
| Output Channel 2 | ECU Pin 89 | Fuel Injector Cylinder 2 (N31) |
| Output Channel 3 | ECU Pin 96 | Fuel Injector Cylinder 3 (N32) |
| Output Channel 4 | ECU Pin 97 | Fuel Injector Cylinder 4 (N33) |
| Output Channel 5 | ECU Pin 104 / 105 | Wastegate Frequency Solenoid (N75) |
| Output Channel 6 | ECU Pin 64 | Diverter Valve Solenoid (N249) |
| Output Channel 7 | ECU Pin 112 | Variable Cam Timing Solenoid (N205) |
| Output Channel 8 | ECU Pin 115 | Secondary Air Combivalve Solenoid (N112) |
| Output Channel 9 | ECU Pin 15 | EVAP Canister Purge Solenoid (N80) |
| Output Channel 10 | ECU Pin 65 | Fuel Pump Master Relay Trigger (J17) |
| Output Channel 11 | ECU Pin 106 | Secondary Air Pump Relay Trigger (J299) |
| Output Channel 12 | ECU Pin 113 | EVAP Leak Detection Pump Solenoid (V144) |
| Output Channel 13 | ECU Pin 116 | Spare Uncommitted PWM Driver Stage |
| Output Channel 14 | Internal PCB | Cooling Fan Stage 1 Relay Driver |
34.3. Hardware Diagnostic Measurements & Rework Protocols#
1. Diagnosing a Missing 5.0\text{V} Sensor Reference (DTC P0642 / P0643)#
- Connect bench power (Pins 1 & 2 Ground, Pin 21 +12\text{V}, Pin 62 +12\text{V}).
- Inspect the small surface-mount Schottky protection diode adjacent to the
30343regulator. A shorted engine harness (e.g. cam sensor wire grounding out on the cylinder head) frequently blows this protection diode. - If the diode is intact but the
30343gets hot to the touch (> 80\text{°C}), the internal regulator pass transistor is destroyed; replace the30343IC.
- Inspect the small surface-mount Schottky protection diode adjacent to the
- Measure voltage on ECU Pin 108 (Sensor Reference) relative to Pin 4 (Sensor Ground).
- If Voltage is 0.0\text{V}:
2. Component Rework Technique (Preventing Thermal Pad Lifting)#
Because the ME7.5 PCB incorporates massive internal ground planes, touching an iron tip directly to an IC pin will draw away heat instantly, risking ripped copper traces.
- Rework Protocol:
- Place the bare PCB on a pre-heater plate set to 140\text{°C} \dots 150\text{°C} for 5 minutes to soak the ground planes.
- Apply tacky no-clean RMA flux generously across all pins.
- Use a focused hot-air nozzle (340\text{°C} \dots 360\text{°C} at medium airflow) circling the perimeter of the IC until all solder joints liquefy simultaneously.
- Lift the chip vertically using vacuum tweezers; never force or pry while solder is partially solid.
- Clean pads with copper desoldering braid and isopropyl alcohol (99\%) before seating the replacement silicon.
Related#
Cross-referenced on shared calibration symbols, not on subject matter — these are the chapters that touch the same maps.
- Chapter 7 — DFPM & Emissions Strategy —
J17,V144,J299,N112,N249,N205 - Chapter 2 — Bosch Project Taxonomy —
J17,J299,N112,N249,N205,N80 - Chapter 13 — 121-Pin Harness —
J17,V144,N112,N249,N205,N80 - Chapter 46 — Secondary Air Injection —
N112,J299,N249 - Chapter 9 — Donor ECU Conversion —
V144,J299,N80 - Chapter 5 — Cross-Flash Clusters —
N249,N205,N75
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Related
Cross-referenced on shared calibration symbols, not on subject matter — these are the chapters that touch the same maps.